Ceramics & Glass Waterjet Cutting Services

Glass • Sapphire • Fused Silica • Ceramics • Silicon • Refractories

Rayotek’s high precision waterjet cutting services and machining center is specifically configured for precision shaping of hard, brittle materials and to facilitate repeatable accuracy for cutting patterned products. Rayotek’s Waterjet cutting services are offered to replace far more costly and time consuming diamond cutting and grinding methods.

Rayotek’s custom configured ceramics and glass waterjet cutting services and machining center is also dedicated to cutting brittle materials such as sapphire, fused quartz, fused silica, silicon nitride, alumina and other refractories. Rayotek’s expertise in cutting these hard materials results in reduced micro-structure damage to material surfaces. Parts with reduced micro-structure damage are more resilient to thermal cycling and mechanical stresses, making them stronger and more durable.

For patterned wafers and components, a special camera imaging system is used to electronically locate feducials or designated locating marks. Our high precision ceramic and glass waterjet cutting system allows for precise and repeatable cutting of patterned features also on silicon, silica wafers and sheets without damaging delicate parts. This is ideal for patterned medical and semiconductor devices which must be cut precisely from wafers; such as complex shapes for heater traces and other electronic devices.

Rayotek also has a number of thermal processing systems for oxygen, inert, reducing and vacuum annealing of cut and ground parts to temperatures up to 1800⁰ C for post process stress reduction.

Our on-site engineering staff is available to discuss
your unique ceramics or glass waterjet cutting and grinding needs, or any other material such as sapphire, quartz, fused silica, silicon and other refractories.

Waterjet Cutting Services Benefits to You

High precision
Fast turn-around
Minimal material waste
High yields on patterned parts
Reduced cutting surface damage
Increased strength of cut parts
On-site engineering and design assistance

Ceramics and Glass Waterjet cutting services are also available for the following materials:

Silicon
Fused quartz
Fused silica
Borosilicate glass (Pyrex type glass)
Sapphire and other crystalline materials
Alumina, zirconia, aluminum nitride, silicon carbide and other ceramics
Molybdenum, titanium, tantalum, tungsten and other refractory metals

Specific Ceramic and Glass Waterjet Cutting Services offered:

Precision waterjet cutting & shaping
Patterned wafer cutting & dicing
Edge trimming
Hole cutting (all shapes down to 2mm inside dimension)
Prototyping
Small, specialty runs
High volume production
Cad/Cam design/file conversion
Contract R&D

Waterjetting Cutting Services offered for the following Industries:

Aerospace
Medical devices
Cell phone and PDA
Micro and macro optics
Semiconductor

Waterjet Cutting and Machining Specifications Manufacturing Capabilities of our 4-Axis System Work Envelope
Maximum cutting X-axis	52 in
Maximum cutting Y-axis	26 in
Minimum cutting X-axis	0.040 in
Minimum cutting Y-axis	0.040 in
Maximum thickness Z-axis	8 in
Minimum thickness Z-axis	<0.001 in
Accuracy of Motion *
Over 1 foot travel	±0.0015 in
Repeatability	±0.0005 in
Squareness	0.0005 in/ft
Straightness	0.0005 in/ft
*Actual Machine accuracy is determined by design, material and thickness.

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