Ceramics & Glass Waterjet Cutting Services



Glass  •  Sapphire  •  Fused Silica  •  Ceramics  •  Silicon  •  Refractories

Rayotek’s high precision waterjet cutting services and machining center is specifically configured for precision shaping of hard, brittle materials and to facilitate repeatable accuracy for cutting patterned products. Rayotek’s Waterjet cutting services are offered to replace far more costly and time consuming diamond cutting and grinding methods.

Rayotek’s custom configured ceramics and glass waterjet cutting services and machining center is also dedicated to cutting brittle materials such as sapphire, fused quartz, fused silica, silicon nitride, alumina and other refractories. Rayotek’s expertise in cutting these hard materials results in reduced micro-structure damage to material surfaces. Parts with reduced micro-structure damage are more resilient to thermal cycling and mechanical stresses, making them stronger and more durable.

For patterned wafers and components, a special camera imaging system is used to electronically locate feducials or designated locating marks. Our high precision ceramic and glass waterjet cutting system allows for precise and repeatable cutting of patterned features also on silicon, silica wafers and sheets without damaging delicate parts. This is ideal for patterned medical and semiconductor devices which must be cut precisely from wafers; such as complex shapes for heater traces and other electronic devices.

Rayotek also has a number of thermal processing systems for oxygen, inert, reducing and vacuum annealing of cut and ground parts to temperatures up to 1800⁰ C for post process stress reduction.

   

Our on-site engineering staff is available to discuss
your unique ceramics or glass waterjet cutting and grinding needs, or any other material such as sapphire, quartz, fused silica, silicon and other refractories.

Waterjet Cutting Services Benefits to You

  • High precision
  • Fast turn-around
  • Minimal material waste
  • High yields on patterned parts
  • Reduced cutting surface damage
  • Increased strength of cut parts
  • On-site engineering and design assistance

Ceramics and Glass Waterjet cutting services are also available for the following materials:

  • Silicon
  • Fused quartz
  • Fused silica
  • Borosilicate glass (Pyrex type glass)
  • Sapphire and other crystalline materials
  • Alumina, zirconia, aluminum nitride, silicon carbide and other ceramics
  • Molybdenum, titanium, tantalum, tungsten and other refractory metals

Specific Ceramic and Glass Waterjet Cutting Services offered:

  • Precision waterjet cutting & shaping
  • Patterned wafer cutting & dicing
  • Edge trimming
  • Hole cutting (all shapes down to 2mm inside dimension)
  • Prototyping
  • Small, specialty runs
  • High volume production
  • Cad/Cam design/file conversion
  • Contract R&D

Waterjetting Cutting Services offered for the following Industries:

  • Aerospace
  • Medical devices
  • Cell phone and PDA
  • Micro and macro optics
  • Semiconductor



 


Waterjet Cutting and Machining Specifications
Manufacturing Capabilities of our 4-Axis System

Work Envelope

Maximum cutting X-axis

52  in

Maximum cutting Y-axis

26  in

Minimum cutting X-axis

0.040  in

Minimum cutting Y-axis

0.040  in

Maximum thickness Z-axis

8 in

Minimum thickness Z-axis

<0.001 in

Accuracy of Motion *

Over 1 foot travel

±0.0015 in

Repeatability

±0.0005 in

Squareness

0.0005 in/ft

Straightness

0.0005 in/ft

*Actual Machine accuracy is determined by design, material and thickness.

 
           


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2014 Rayotek Scientific Inc.
11499 Sorrento Valley Road, San Diego, CA 92121 USA, Tel: 858-558-3671

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